Kaneko, Satoshi. Design and Control of Highly Conductive Single-Molecule Junctions [[electronic resource] :] : a Focus on the Metal–Molecule Interface / / Satoshi. Kaneko ; . - 1st ed. 2017. - [S. l. : s. n.]. - XIII, 84 p. 40 illus., 38 illus. in color. - Б. ц. Зміст: Introduction -- Theoretical background -- Experimental concepts and techniques -- Design of the metal–molecule interaction at the benzene single-molecule junction -- Design of the interface structure of a single-molecule junction utilizing spherical endohedral Ce@C82 metallofullerenes -- Anchoring groups enclosed in the ?-conjugated system in N2 molecules -- Controlling the electrical property of highly conductive pyrazine single-molecule junction -- General conclusions. Рубрики: Physical chemistry. Nanoscale science. Nanoscience. Nanostructures. Nanotechnology. Nanochemistry. Electronics. Microelectronics. Physical Chemistry. Nanoscale Science and Technology. Nanotechnology. Nanochemistry. Electronics and Microelectronics, Instrumentation. Анотація: This thesis describes improvements to and control of the electrical conductance in single-molecule junctions (SMJs), which have potential applications in molecular electronics, with a focus on the bonding between the metal and molecule. In order to improve the electrical conductance, the ? orbital of the molecule is directly bonded to the metal orbital, because anchoring groups, which were typically used in other studies to bind molecule with metal electrodes, became resistive spacers. Using this direct ?-binding, the author has successfully demonstrated highly conductive SMJs involving benzene, endohedral metallofullerene Ce@C82, and nitrogen. Subsequently, the author investigated control of the electrical conductance of SMJs using pyrazine. The nitrogen atom in the ?-conjugated system of pyrazine was expected to function as an anchoring point, and two bonding states were expected. One originates primarily from the ? orbital, while the other originates primarily from an n state of the nitrogen. Measurements of conductance and dI/dV spectra coupled with theoretical calculations revealed that the pyrazine SMJ has bistable conductance states, in which the pyrazine axis is either tilted or parallel with respect to the junction axis. The bistable states were switched by changing the gap size between the metal electrodes using an external force. Notably, it is difficult to change the electrical properties of bulk-state materials using mechanical force. The findings reveal that the electron transport properties of a SMJ can be controlled by designing a proper metal–molecule interface, which has considerable potential for molecular electronics. Moreover, this thesis will serve as a guideline for every step of SMJ research: design, fabrication, evaluation, and control. Перейти: https://doi.org/10.1007/978-981-10-4412-0 Дод.точки доступу: Kaneko, Satoshi. \.\; SpringerLink (Online service) Свободных экз. нет |
Charge-Trapping Non-Volatile Memories [[electronic resource] :] : volume 2--Emerging Materials and Structures / / ed. Dimitrakis, Panagiotis. - 1st ed. 2017. - [S. l. : s. n.]. - V, 211 p. 170 illus., 117 illus. in color. - Б. ц. Зміст: Materials and Device Reliability in SONOS Memories -- Charge-Trap-Non-Volatile Memory and Focus on Flexible Flash Memory Devices -- Hybrid Memories Based on Redox Molecules -- Organic Floating-Gate Memory Structures -- Nanoparticles Based Flash-like Non Volatile Memories: Cluster Beam Synthesis of Metallic Nanoparticles and Challenges for the Overlying Control Oxide Layer. Рубрики: Nanotechnology. Electronic circuits. Electronics. Microelectronics. Computer memory systems. Engineering—Materials. Nanotechnology. Electronic Circuits and Devices. Electronics and Microelectronics, Instrumentation. Memory Structures. Materials Engineering. Анотація: This book describes the technology of charge-trapping non-volatile memories and their uses. The authors explain the device physics of each device architecture and provide a concrete description of the materials involved and the fundamental properties of the technology. Modern material properties, used as charge-trapping layers, for new applications are introduced. Provides a comprehensive overview of the technology for charge-trapping non-volatile memories; Details new architectures and current modeling concepts for non-volatile memory devices; Focuses on conduction through multi-layer gate dielectrics stacks. Перейти: https://doi.org/10.1007/978-3-319-48705-2 Дод.точки доступу: Dimitrakis, Panagiotis. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Mukherjee, Sanjoy. Organic Radical Polymers [[electronic resource] :] : new Avenues in Organic Electronics / / Sanjoy. Mukherjee, Boudouris, Bryan W. ; . - 1st ed. 2017. - [S. l. : s. n.]. - IX, 80 p. 42 illus. in color. - Б. ц. Зміст: Chapter 1. An Introduction to Radical Polymers -- Chapter 2. Syntheses of Radical Polymers -- Chapter 3. Applications of Radical Polymers in Electrolyte-supported Devices -- Chapter 4. Applications of Radical Polymers in Solid-state Devices -- Chapter 5. Conclusions and Future Outlook. Рубрики: Optical materials. Electronic materials. Polymers . Electronic circuits. Energy storage. Electronics. Microelectronics. Organic chemistry. Optical and Electronic Materials. Polymer Sciences. Electronic Circuits and Devices. Energy Storage. Electronics and Microelectronics, Instrumentation. Organic Chemistry. Анотація: This book provides a detailed introduction to organic radical polymers and open-shell macromolecules. Functional macromolecules have led to marked increases in a wide range of technologies, and one of the fastest growing of these fields is that of organic electronic materials and devices. To date, synthetic and organic electronic device efforts have focused almost exclusively on closed-shell polymers despite the promise of open-shell macromolecules in myriad applications. This text represents the first comprehensive review of the design, synthesis, characterization, and device applications of open-shell polymers. In particular, it will summarize the impressive synthetic and device performance efforts that have been achieved with respect to energy storage, energy conversion, magnetic, and spintronic applications. By combining comprehensive reviews with a wealth of informative figures, the text provides the reader with a complete “molecules-to-modules” understanding of the state of the art in open-shell macromolecules. Moreover, the monograph highlights future directions for open-shell polymers in order to allow the reader to be part of the community that continues to build the field. In this way, the reader will gain a rapid understanding of the field and will have a clear pathway to utilize these materials in next-generation applications. Перейти: https://doi.org/10.1007/978-3-319-58574-1 Дод.точки доступу: Boudouris, Bryan W.; Mukherjee, Sanjoy. \.\; SpringerLink (Online service) Свободных экз. нет |
Elementary Processes in Organic Photovoltaics [[electronic resource] /] : монография / ed. Leo, Karl. - 1st ed. 2017. - [S. l. : s. n.]. - IX, 421 p. 244 illus., 184 illus. in color. - Б. ц. Зміст: From the contents: Polymeric solar cells: Molecular orientation, structure, and optoelectronic performance -- An integrated approach towards highly efficient bulk-heterojunction solar cells based on dendritic oligothiophenes -- Organic solar cells based on oligothiophene derivatives -- Charge separation at nanostructured molecular donoracceptor interfaces -- p-B-n organic junctions for efficient photovoltaics -- Interplay between microscopic structure and intermolecular charge transfer processes in polymer-fullerene bulk-heterojunctions -- Organic solar cells from optimized self-assembling block copolymers with controlled nanoscale morphology. Рубрики: Polymers . Optical materials. Electronic materials. Renewable energy resources. Semiconductors. Physical chemistry. Electronics. Microelectronics. Polymer Sciences. Optical and Electronic Materials. Renewable and Green Energy. Semiconductors. Physical Chemistry. Electronics and Microelectronics, Instrumentation. Анотація: This volume presents the results of a multi-year research programme funded by the Deutsche Forschungsgemeinschaft (German Research Council), which explains how organic solar cells work. In this new promising photovoltaic technology, carbon-based materials are deposited by low-cost methods onto flexible substrates, thus allowing devices which open completely new applications like transparent coatings for building, solar cells integrated into clothing or packages, and many more. The investigation of organic solar cells is an interdisciplinary topic, covering physics, chemistry and engineering. The different chapters address topics ranging from the synthesis of new organic materials, to the characterization of the elementary processes such as exciton transport and separation, and the principles of highly efficient device design. Перейти: https://doi.org/10.1007/978-3-319-28338-8 Дод.точки доступу: Leo, Karl. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Springer Handbook of Electronic and Photonic Materials [[electronic resource] /] : монография / ed.: Kasap, Safa., Capper, Peter. - 2nd ed. 2017. - [S. l. : s. n.]. - XXXVI, 1536 p. 1088 illus. in color. - Б. ц. Зміст: Part A Fundamental Properties -- Part B Growth and Characterization -- Part C Materials for Electronics -- Part D Materials for Optoelectronics and Photonics -- Part E Novel Materials and Selected Applications. Рубрики: Optical materials. Electronic materials. Electronics. Microelectronics. Solid state physics. Spectroscopy. Microscopy. Lasers. Photonics. Materials—Surfaces. Thin films. Optical and Electronic Materials. Electronics and Microelectronics, Instrumentation. Solid State Physics. Spectroscopy and Microscopy. Optics, Lasers, Photonics, Optical Devices. Surfaces and Interfaces, Thin Films. Анотація: The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials. Перейти: https://doi.org/10.1007/978-3-319-48933-9 Дод.точки доступу: Kasap, Safa. \ed.\; Capper, Peter. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Phan, Hoang-Phuong. Piezoresistive Effect of p-Type Single Crystalline 3C-SiC [[electronic resource] :] : silicon Carbide Mechanical Sensors for Harsh Environments / / Hoang-Phuong. Phan ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXI, 146 p. 94 illus., 3 illus. in color. - Б. ц. Зміст: Introduction and Literature Review -- Theory of the Piezoresistive E?ect in p-type 3C-Sic -- 3C-Sic Film Growth and Sample Preparation -- Characterization of the Piezoresistive E?ect in p-type Single Crystalline 3C-Sic -- The Piezoresistive E?ect in p-type Nanocrystalline Sic -- The Piezoresistive E?ect of Top Down p-type 3C-Sic Nanowires -- Conclusion and Future Work. Рубрики: Optical materials. Electronic materials. Electronics. Microelectronics. Solid state physics. Optical and Electronic Materials. Electronics and Microelectronics, Instrumentation. Solid State Physics. Анотація: This book addresses the piezoresistance in p-type 3C-SiC, which it investigates using experimental characterization and theoretical analysis. The gauge factor, the piezoresistive coefficients in two-terminal and four-terminal resistors, the comparison between single crystalline and nanocrystalline SiC, along with the temperature dependence of the piezoresistive effect in p-type 3C-SiC are also discussed. Silicon carbide (SiC) is an excellent material for electronic devices operating at high temperatures, thanks to its large energy band gap, superior mechanical properties and extreme chemical inertness. Among the numerous poly types of SiC, the cubic single crystal, which is also well known as 3C-SiC, is the most promising platform for microelectromechanical (MEMS) applications, as it can be epitaxially grown on an Si substrate with diameters of up to several hundred millimeters. This feature makes 3C-SiC compatible with the conventional Si-based micro/nano processing and also cuts down the cost of SiC wafers. The investigation into the piezoresistive effect in 3CSiC is of significant interest for the development of mechanical transducers such as pressure sensors and strain sensors used for controlling combustion and deep well drilling. Although a number of studies have focused on the piezoresistive effect in n-type 3C-SiC, 4H-SiC and 6H-SiC, comparatively little attention has been paid to piezoresistance in p-type 3C-SiC. In addition, the book investigates the piezoresistive effect of top-down fabricated SiC nanowires, revealing a high degree of sensitivity in nanowires employing an innovative nano strain-amplifier. The large gauge factors of the p-type 3C-SiC at both room temperature and high temperatures found here indicate that this poly type could be suitable for the development of mechanical sensing devices operating in harsh environments with high temperatures.iv. Перейти: https://doi.org/10.1007/978-3-319-55544-7 Дод.точки доступу: Phan, Hoang-Phuong. \.\; SpringerLink (Online service) Свободных экз. нет |
RF and Microwave Microelectronics Packaging II [[electronic resource] /] : монография / ed.: Kuang, Ken., Sturdivant, Rick. - 1st ed. 2017. - [S. l. : s. n.]. - XII, 172 p. 127 illus., 77 illus. in color. - Б. ц. Зміст: Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging. Рубрики: Electronics. Microelectronics. Microwaves. Optical engineering. Electronic circuits. Electronics and Microelectronics, Instrumentation. Microwaves, RF and Optical Engineering. Circuits and Systems. Анотація: Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. Перейти: https://doi.org/10.1007/978-3-319-51697-4 Дод.точки доступу: Kuang, Ken. \ed.\; Sturdivant, Rick. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Taraate, Vaibbhav. PLD Based Design with VHDL [[electronic resource] :] : RTL Design, Synthesis and Implementation / / Vaibbhav. Taraate ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXI, 423 p. 246 illus. - Б. ц. Зміст: Introduction to HDL -- Basic Logic Circuits and VHDL Description -- VHDL and Key Important Constructs -- 4 Combinational Logic Design Using VHDL Constructs -- Sequential Logic Design -- Introduction to PLD -- Design and simulation using VHDL constructs -- PLD Based Design Guidelines -- Finite State Machines -- Synthesis Optimization using VHDL -- Design Implementation Using Xilinx Vivado. Рубрики: Electronic circuits. Electronics. Microelectronics. Microprogramming . Circuits and Systems. Electronics and Microelectronics, Instrumentation. Control Structures and Microprogramming. Анотація: This book covers basic fundamentals of logic design and advanced RTL design concepts using VHDL. The book is organized to describe both simple and complex RTL design scenarios using VHDL. It gives practical information on the issues in ASIC prototyping using FPGAs, design challenges and how to overcome practical issues and concerns. It describes how to write an efficient RTL code using VHDL and how to improve the design performance. The design guidelines by using VHDL are also explained with the practical examples in this book. The book also covers the ALTERA and XILINX FPGA architecture and the design flow for the PLDs. The contents of this book will be useful to students, researchers, and professionals working in hardware design and optimization. The book can also be used as a text for graduate and professional development courses. Перейти: https://doi.org/10.1007/978-981-10-3296-7 Дод.точки доступу: Taraate, Vaibbhav. \.\; SpringerLink (Online service) Свободных экз. нет |
Applications in Electronics Pervading Industry, Environment and Society [[electronic resource] :] : APPLEPIES 2015 / / ed. De Gloria, Alessandro. - 1st ed. 2017. - [S. l. : s. n.]. - IX, 236 p. 140 illus., 111 illus. in color. - Б. ц. Зміст: A Wireless Personal Sensor Node for Real Time Dosimetry of Interventional Radiology Operators -- A New FPGA-based Architecture for Iterative and Space-variant Image Processing -- Embedded Electronic Systems for Tactile Data Processing -- Microwave Imaging for Breast Cancer Detection: A COTS-Based Prototype -- A SystemVerilog-UVM Methodology for the Design, Simulation and Veri?cation of Complex Readout Chips in High Energy Physics Applications -- Embedded System for In-Line Characterization of Industrial Fluids -- A Low Cost, Portable Device for Breath Analysis and Self-Monitoring, the Wize Sni?er. Рубрики: Electronics. Microelectronics. Robotics. Automation. Biomedical engineering. Energy harvesting. Electronics and Microelectronics, Instrumentation. Robotics and Automation. Biomedical Engineering and Bioengineering. Energy Harvesting. Анотація: This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2015 ApplePies Conference, held in Rome, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor. Перейти: https://doi.org/10.1007/978-3-319-47913-2 Дод.точки доступу: De Gloria, Alessandro. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Embedded Systems Design with Special Arithmetic and Number Systems [[electronic resource] /] : монография / ed.: Molahosseini, Amir Sabbagh., de Sousa, Leonel Seabra., Chang, Chip-Hong. - 1st ed. 2017. - [S. l. : s. n.]. - X, 389 p. 127 illus., 48 illus. in color. - Б. ц. Зміст: Introduction to Residue Number System: Structure and Teaching Methodology -- RNS-based Embedded Processor Design -- Non Modular Operations of the Residue Number System: Functions for Computing -- Fault-Tolerant Computing in Redundant Residue Number System -- Decimal Floating Point Number System -- Design and Evaluation of Booth-Encoded Multipliers in Redundant Binary Representation -- Robust Analog Arithmetic Based on the Continuous Valued Number System -- RNS Applications in Digital Signal Processing -- RNS-based Image Processing -- Logarithmic Number System and its Application in FIR Filter Design -- Double-Base Number System and its Application in FIR Filter Design -- RNS-based Public-Key Cryptography (RSA and ECC) -- RNS Approach in Lattice-based Cryptography -- RNS Applications in Computer Networks. Рубрики: Electronic circuits. Microprocessors. Electronics. Microelectronics. Circuits and Systems. Processor Architectures. Electronics and Microelectronics, Instrumentation. Анотація: This book introduces readers to alternative approaches to designing efficient embedded systems using unconventional number systems. The authors describe various systems that can be used for designing efficient embedded and application-specific processors, such as Residue Number System, Logarithmic Number System, Redundant Binary Number System Double-Base Number System, Decimal Floating Point Number System and Continuous Valued Number System. Readers will learn the strategies and trade-offs of using unconventional number systems in application-specific processors and be able to apply and design appropriate arithmetic operations from these number systems to boost the performance of digital systems. • Serves as a single-source reference to designing embedded systems with unconventional number systems • Covers theory as well as implementation on application-specific processors • Explains mathematical concepts in a manner accessible to readers with diverse backgrounds. Перейти: https://doi.org/10.1007/978-3-319-49742-6 Дод.точки доступу: Molahosseini, Amir Sabbagh. \ed.\; de Sousa, Leonel Seabra. \ed.\; Chang, Chip-Hong. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Paro Filho, Filho, Pedro Emiliano. Charge-based CMOS Digital RF Transmitters [[electronic resource] /] : монография / Filho, Pedro Emiliano. Paro Filho, Craninckx, Jan., Wambacq, Piet., Ingels, Mark. ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXIX, 152 p. 156 illus., 98 illus. in color. - Б. ц. Зміст: Introduction -- Incremental-charge-based Operation -- Capacitive Charge-based Transmitter -- Resistive Charge-based Transmitter -- Conclusion. Рубрики: Electronic circuits. Electronics. Microelectronics. Signal processing. Image processing. Speech processing systems. Circuits and Systems. Electronics and Microelectronics, Instrumentation. Signal, Image and Speech Processing. Анотація: This book introduces a completely novel architecture that can relax the trade-off existing today between noise, power and area consumption in a very suitable solution for advanced wireless communication systems. Through the combination of charge-domain operation with incremental signaling, this architecture gives the best of both worlds, providing the reduced area and high portability of digital-intensive architectures with an improved out-of-band noise performance given by intrinsic noise filtering capabilities. Readers will be enabled to design higher performance radio front-ends that consume less power and area, especially with respect to the transmitter and power amplifier designs, considered by many the “battery killers” on most mobile devices. Describes an innovative architecture that has proved to support advanced wireless communication systems, with outstanding noise performance and improved power and area consumption; Provides an in-depth description of underlying concepts, implementation and results achieved; Demonstrates two real implementations, showing design details and measurement results. Перейти: https://doi.org/10.1007/978-3-319-45787-1 Дод.точки доступу: Craninckx, Jan.; Wambacq, Piet.; Ingels, Mark.; Paro Filho, Pedro Emiliano. \.\; SpringerLink (Online service) Свободных экз. нет |
Lourenco, Nuno. Automatic Analog IC Sizing and Optimization Constrained with PVT Corners and Layout Effects [[electronic resource] /] : монография / Nuno. Lourenco, Martins, Ricardo., Horta, Nuno. ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXVII, 182 p. 112 illus., 90 illus. in color. - Б. ц. Зміст: Introduction -- Previous Works on Automatic Analog IC Sizing -- AIDA-C Architecture -- Multi-Objective Optimization Kernel -- AIDA-C Circuit Sizing Results -- Layout-Aware Circuit Sizing -- AIDA-C Layout-aware Circuit Sizing Results -- Conclusions. Рубрики: Electronic circuits. Microprocessors. Electronics. Microelectronics. Circuits and Systems. Processor Architectures. Electronics and Microelectronics, Instrumentation. Анотація: This book introduces readers to a variety of tools for automatic analog integrated circuit (IC) sizing and optimization. The authors provide a historical perspective on the early methods proposed to tackle automatic analog circuit sizing, with emphasis on the methodologies to size and optimize the circuit, and on the methodologies to estimate the circuit’s performance. The discussion also includes robust circuit design and optimization and the most recent advances in layout-aware analog sizing approaches. The authors describe a methodology for an automatic flow for analog IC design, including details of the inputs and interfaces, multi-objective optimization techniques, and the enhancements made in the base implementation by using machine leaning techniques. The Gradient model is discussed in detail, along with the methods to include layout effects in the circuit sizing. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. An extensive set of application examples is included to demonstrate the capabilities and features of the methodologies described. Перейти: https://doi.org/10.1007/978-3-319-42037-0 Дод.точки доступу: Martins, Ricardo.; Horta, Nuno.; Lourenco, Nuno. \.\; SpringerLink (Online service) Свободных экз. нет |
Hardware IP Security and Trust [[electronic resource] /] : монография / ed.: Mishra, Prabhat., Bhunia, Swarup., Tehranipoor, Mark. - 1st ed. 2017. - [S. l. : s. n.]. - XII, 353 p. 131 illus., 78 illus. in color. - Б. ц. Зміст: Part I. Introduction -- Chapter 1.Security and Trust Vulnerabilities in Third-party IPs -- PArt II.Trust Analysis -- Chapter 2.Security Rule Check -- Chapter 3.Digital Circuit Vulnerabilities to Hardware Trojans -- Chapter 4.Code Coverage Analysis for IP Trust Verification -- Chapter 5.Analyzing Circuit Layout to Probing Attack -- Chapter 6.Testing of Side Channel Leakage of Cryptographic IPs: Metrics and Evaluations -- Part III -- Effective Countermeasures -- Chapter 7.Hardware Hardening Approaches using Camouflaging, Encryption and Obfuscation -- Chapter 8.A Novel Mutating Runtime Architecture for Embedding Multiple Countermeasures Against Passive Side Channel Attacks -- Part IV -- Chapter 9.Validation of IP Security and Trust -- Chapter 10.IP Trust Validation using Proof-carrying Hardware -- Chapter 11. Hardware Trust Verification -- Chapter 12.Verification of Unspecified IP Functionality -- Chapter 13.Verifying Security Properties in Modern SoCs using Instruction-level Abstractions -- Chapter 14. Test Generation for Detection of Malicious Parametric Variations -- Part V. Conclusions -- Chapter 15.The Future of Trustworthy SoC Design. Рубрики: Electronic circuits. Data encryption (Computer science). Computer security. Electronics. Microelectronics. Microprocessors. Circuits and Systems. Cryptology. Systems and Data Security. Electronics and Microelectronics, Instrumentation. Processor Architectures. Анотація: This book provides an overview of current Intellectual Property (IP) based System-on-Chip (SoC) design methodology and highlights how security of IP can be compromised at various stages in the overall SoC design-fabrication-deployment cycle. Readers will gain a comprehensive understanding of the security vulnerabilities of different types of IPs. This book would enable readers to overcome these vulnerabilities through an efficient combination of proactive countermeasures and design-for-security solutions, as well as a wide variety of IP security and trust assessment and validation techniques. This book serves as a single-source of reference for system designers and practitioners for designing secure, reliable and trustworthy SoCs. Перейти: https://doi.org/10.1007/978-3-319-49025-0 Дод.точки доступу: Mishra, Prabhat. \ed.\; Bhunia, Swarup. \ed.\; Tehranipoor, Mark. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Bindal, Ahmet. Electronics for Embedded Systems [[electronic resource] /] : монография / Ahmet. Bindal ; . - 1st ed. 2017. - [S. l. : s. n.]. - XIII, 298 p. 357 illus. - Б. ц. Зміст: Fundamentals of Passive Circuit Analysis -- Diode and Bipolar Transistor Circuits -- MOS Transistors and CMOS Circuits -- TTL Logic and CMOS-TTL Interface -- Physics of Sensors -- Operational Amplifiers and Circuits -- Data Converters -- Front-End Electronics for Embedded Systems -- Review of Combinational and Sequential Logic Circuits and Design. Рубрики: Electronic circuits. Electronics. Microelectronics. Circuits and Systems. Electronics and Microelectronics, Instrumentation. Анотація: This book provides semester-length coverage of electronics for embedded systems, covering most common analog and digital circuit-related issues encountered while designing embedded system hardware. It is written for students and young professionals who have basic circuit theory background and want to learn more about passive circuits, diode and bipolar transistor circuits, the state-of-the-art CMOS logic family and its interface with older logic families such as TTL, sensors and sensor physics, operational amplifier circuits to condition sensor signals, data converters and various circuits used in electro-mechanical device control in embedded systems. The book also provides numerous hardware design examples by integrating the topics learned in earlier chapters. The last chapter extensively reviews the combinational and sequential logic design principles to be able to design the digital part of embedded system hardware. Перейти: https://doi.org/10.1007/978-3-319-39439-8 Дод.точки доступу: Bindal, Ahmet. \.\; SpringerLink (Online service) Свободных экз. нет |
Materials for Advanced Packaging [[electronic resource] /] : монография / ed.: Lu, Daniel., Wong, C.P. - 2nd ed. 2017. - [S. l. : s. n.]. - XVI, 969 p. 700 illus., 440 illus. in color. - Б. ц. Зміст: 3D Integration Technologies – An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias. Рубрики: Electronics. Microelectronics. Nanotechnology. Metals. Optical materials. Electronic materials. Electronic circuits. Electronics and Microelectronics, Instrumentation. Nanotechnology and Microengineering. Metallic Materials. Optical and Electronic Materials. Circuits and Systems. Анотація: This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing. Перейти: https://doi.org/10.1007/978-3-319-45098-8 Дод.точки доступу: Lu, Daniel. \ed.\; Wong, C.P. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Pandit, Shweta. Spectrum Sharing in Cognitive Radio Networks [[electronic resource] :] : medium Access Control Protocol Based Approach / / Shweta. Pandit, Singh, Ghanshyam. ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXIII, 254 p. 81 illus., 58 illus. in color. - Б. ц. Зміст: Cognitive Radio Communication System?Spectrum Sharing Techniques -- Spectrum Sensing in Cognitive Radio: Potential Techniques and Future Perspective -- Medium Access Control Protocol for Distributed Cognitive Radio Network -- Distributed Cognitive Radio Medium Access Control Protocol in Perfect and Imperfect Channel Sensing Scenarios -- Throughput Enhancement using Bandwidth Wastage in MAC Protocol of the Distributed Cognitive Radio Network -- Power Allocation for Optimum Energy Efficiency in MAC Protocol of Cognitive Radio Communication System -- Frame Structure for Throughput Maximization in Cognitive Radio Communication -- Capacity Limits over Fading Environment with Imperfect Channel State Information for Cognitive Radio Network -- Channel Capacity of Cognitive Radio in Fading Environment with CSI and Interference Power Constraints -- Framework for Cross-Layer Optimization in Cognitive Radio Network. Рубрики: Electronic circuits. Signal processing. Image processing. Speech processing systems. Energy efficiency. Electronics. Microelectronics. Circuits and Systems. Signal, Image and Speech Processing. Energy Efficiency. Electronics and Microelectronics, Instrumentation. Анотація: This book discusses the use of the spectrum sharing techniques in cognitive radio technology, in order to address the problem of spectrum scarcity for future wireless communications. The authors describe a cognitive radio medium access control (MAC) protocol, with which throughput maximization has been achieved. The discussion also includes use of this MAC protocol for imperfect sensing scenarios and its effect on the performance of cognitive radio systems. The authors also discuss how energy efficiency has been maximized in this system, by applying a simple algorithm for optimizing the transmit power of the cognitive user. The study about the channel fading in the cognitive user and licensed user and power adaption policy in this scenario under peak transmit power and interference power constraint is also present in this book. Перейти: https://doi.org/10.1007/978-3-319-53147-2 Дод.точки доступу: Singh, Ghanshyam.; Pandit, Shweta. \.\; SpringerLink (Online service) Свободных экз. нет |
Mahjoubfar, Ata. Artificial Intelligence in Label-free Microscopy [[electronic resource] :] : biological Cell Classification by Time Stretch / / Ata. Mahjoubfar, Chen, Claire Lifan., Jalali, Bahram. ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXXIII, 134 p. 52 illus. in color. - Б. ц. Зміст: Introduction -- Background -- Nanometer-resolved imaging vibrometer -- Three-dimensional ultrafast laser scanner -- Label-free High-throughput Phenotypic Screening -- Time Stretch Quantitative Phase Imaging -- Big data acquisition and processing in real-time -- Deep Learning and Classification -- Optical Data Compression in Time Stretch Imaging -- Design of Warped Stretch Transform -- Concluding Remarks and Future Work -- References. Рубрики: Biomedical engineering. Electronics. Microelectronics. Optical data processing. Bioinformatics. Biomedical Engineering and Bioengineering. Electronics and Microelectronics, Instrumentation. Image Processing and Computer Vision. Bioinformatics. Анотація: This book introduces time-stretch quantitative phase imaging (TS-QPI), a high-throughput label-free imaging flow cytometer developed for big data acquisition and analysis in phenotypic screening. TS-QPI is able to capture quantitative optical phase and intensity images simultaneously, enabling high-content cell analysis, cancer diagnostics, personalized genomics, and drug development. The authors also demonstrate a complete machine learning pipeline that performs optical phase measurement, image processing, feature extraction, and classification, enabling high-throughput quantitative imaging that achieves record high accuracy in label -free cellular phenotypic screening and opens up a new path to data-driven diagnosis. • Demonstrates how machine learning is used in high-speed microscopy imaging to facilitate medical diagnosis; • Provides a systematic and comprehensive illustration of time stretch technology; • Enables multidisciplinary application, including industrial, biomedical, and artificial intelligence. Перейти: https://doi.org/10.1007/978-3-319-51448-2 Дод.точки доступу: Chen, Claire Lifan.; Jalali, Bahram.; Mahjoubfar, Ata. \.\; SpringerLink (Online service) Свободных экз. нет |
Advanced Interfacing Techniques for Sensors [[electronic resource] :] : measurement Circuits and Systems for Intelligent Sensors / / ed. George, Boby. [et al.]. - 1st ed. 2017. - [S. l. : s. n.]. - XIV, 314 p. 193 illus., 121 illus. in color. - Б. ц. Зміст: Sensors and their characteristics -- Advanced Interfacing Techniques for the Capacitive Sensors -- A Simple Embedded Sensor: Excitation and Interfacing -- AdvancedTechniques for Directly Interfacing Resistive Sensors to Digital Systems -- Interfaces for AutarkicWireless Sensors and Actuators in the Internet of Things -- Lock-In Amplifier Architectures for Sub-Ppm Resolution Measurements -- Biomedical Sensors and Their Interfacing -- Interfacing and Pre-ProcessingTechniques with Olfactory and Taste Sensors -- Harnessing Vision and Touch for Compliant Robotic Interaction with Soft or Rigid Objects -- IEEE1451 Smart Sensors Architectures for Vital Signs and Motor Activity Monitoring. Рубрики: Electronics. Microelectronics. Electronic circuits. Applied mathematics. Engineering mathematics. Physical measurements. Measurement . Electronics and Microelectronics, Instrumentation. Circuits and Systems. Mathematical and Computational Engineering. Measurement Science and Instrumentation. Анотація: This book presents ways of interfacing sensors to the digital world, and discusses the marriage between sensor systems and the IoT: the opportunities and challenges. As sensor output is often affected by noise and interference, the book presents effective schemes for recovering the data from a signal that is buried in noise. It also explores interesting applications in the area of health care, un-obstructive monitoring and the electronic nose and tongue. It is a valuable resource for engineers and scientists in the area of sensors and interfacing wanting to update their knowledge of the latest developments in the field and learn more about sensing applications and challenges. Перейти: https://doi.org/10.1007/978-3-319-55369-6 Дод.точки доступу: George, Boby. \ed.\; Roy, Joyanta Kumar. \ed.\; Kumar, V. Jagadeesh. \ed.\; Mukhopadhyay, Subhas Chandra. \ed.\; SpringerLink (Online service) Свободных экз. нет |
Margarit, Josep Maria. Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications [[electronic resource] /] : монография / Josep Maria. Margarit ; . - 1st ed. 2017. - [S. l. : s. n.]. - XXI, 173 p. 105 illus., 4 illus. in color. - Б. ц. Зміст: Introduction -- Frame-Based Smart IR Imagers -- Frame-Free Compact-Pitch IR Imagers -- Pixel Test Chips in 0.35mm and 0.15mm CMOS Technologies -- Imager Test Chips in 2.5mm, 0.35mm and 0.15mm CMOS Technologies -- Conclusions. Рубрики: Electronics. Microelectronics. Solid state physics. Optical data processing. Electronics and Microelectronics, Instrumentation. Solid State Physics. Image Processing and Computer Vision. Анотація: This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimized by the use of comprehensive MOSFET subthreshold operation. Перейти: https://doi.org/10.1007/978-3-319-49962-8 Дод.точки доступу: Margarit, Josep Maria. \.\; SpringerLink (Online service) Свободных экз. нет |
Banerjee, Amal. Automated Electronic Filter Design [[electronic resource] /] : монография / Amal. Banerjee ; . - 1st ed. 2017. - [S. l. : s. n.]. - VIII, 87 p. 35 illus., 13 illus. in color. - Б. ц. Зміст: Introduction and Problem Statement -- Automated Electronic Filter Design Scheme -- Automated Electronic Filter Design Algorithm/Scheme Implementation and Design Examples -- Higher Frequencies (100's of MHz – 10's of GHz) - Physical Constraints and Distributed Filters -- Summary and Conclusion -- Appendix A Using the Automated Filter Design Tool. Рубрики: Electronic circuits. Electronics. Microelectronics. Circuits and Systems. Electronic Circuits and Devices. Electronics and Microelectronics, Instrumentation. Анотація: This book describes a novel, efficient and powerful scheme for designing and evaluating the performance characteristics of any electronic filter designed with predefined specifications. The author explains techniques that enable readers to eliminate complicated manual, and thus error-prone and time-consuming, steps of traditional design techniques. The presentation includes demonstration of efficient automation, using an ANSI C language program, which accepts any filter design specification (e.g. Chebyschev low-pass filter, cut-off frequency, pass-band ripple etc.) as input and generates as output a SPICE(Simulation Program with Integrated Circuit Emphasis) format netlist. Readers then can use this netlist to run simulations with any version of the popular SPICE simulator, increasing accuracy of the final results, without violating any of the key principles of the traditional design scheme. Перейти: https://doi.org/10.1007/978-3-319-43470-4 Дод.точки доступу: Banerjee, Amal. \.\; SpringerLink (Online service) Свободных экз. нет |